Le-Ping Mao
Biography
He is currently an Undergraduate Summer Student Assistant in the Department of Electrical and Computer Engineering, University of Saskatchewan, Canada, under supervision of Dr. C.Y. Chung.
In spring 2014, he worked as Research Assistant in Synchrotron Laboratory for Micro And Nano Devices (SyLMAND), University of Saskatchewan, Canada, focusing on nickel electroplating in areas of parameters affecting the results of uniformity of thickness of nickel deposits on silicon wafers.
He received many scholarships offered by the University of Saskatchewan as well as other sponsors, including SaskPower Industry Awards, The Douglas Durie Memorial Scholarship, University of Saskatchewan Entrance Competitive Scholarships, etc.
Honors and Achievements
2016 The Douglas Durie Memorial Scholarship (CAD 3000)2015-16 SaskPower Industry Awards (CAD 3000 each Year)
2015 First Year Engineering Dean’s Honor Roll
2015 The Hub City Curling Club Legacy/Curl Saskatoon Award (CAD 1250)
2014 University of Saskatchewan Entrance Competitive Scholarships (CAD 6000 each year, renewed annually for 4 years)
2014 CAP High School Physics Competition - First Place in the Province of Saskatchewan
Experience
Academic and Working ExperienceSummer 2016: Undergraduate Summer Student Assistant - Department of Electrical and Computer Engineering, University of Saskatchewan, Canada
Spring 2014: Researching Assistant - Synchrotron Laboratory for Micro And Nano Devices (SyLMAND), University of Saskatchewan, Canada
Student Societies Experience
2016 - Current: Financial Officer - Engineers Without Borders Canada, University of Saskatchewan Chapter
Publications
Selected Publications
Research
Current Research Area
Contact Information
Le-Ping Mao
Undergraduate Student
Department of Electrical and Computer Engineering,
University of Saskatchewan,
3C73, Engineering Building, 57 Campus Drive, Saskatoon, SK S7N 5A9, Canada. Email: lepingmao@yahoo.ca